TECHNICAL CAPABILITIES

Sr. No.	Parameter	Capabilities
1	Base Laminate Material	FR4, Metal Clad, FR1, CEM3, CEM1
2	Board Thickness	0.40 mm to 3.2 mm
3	Layer Count	01 to 02
4	Board Finish	HAL (TIN, LEAD), Roller TIN
5	Solder Mask	PSM (Green, Black, White, Red, Yellow)
6	Finished Cu Thickness	1 oz to 3 oz
7	Minimum Track Width	10 mil (0.254 mm)
8	Minimum Space between Tracks	10 mil (0.254 mm)
9	Minimum Hole Size Finished	0.5 mm
10	Tolerances on PCB Profile (CNC Routing)	+/- 0.25 mm
11	Tolerances on PTH & NPTH Diameter
	Up to 0.8 mm	+/- 0.05 mm
	0.85 mm to 2.00 mm	+/- 0.15 mm
	2.05 mm to 5.30 mm	+/- 0.20 mm
	Above 5.30 mm	+/- 0.30 mm
12	Maximum Board Size	450 mm X 400 mm
13	V Grooving	0.5 mm
14	Bare Board Testing	FPT & JIG Method

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